| 1. | Familiar with deep submicron process design rule 熟悉深亚微米工艺设计规则。 |
| 2. | Longer paths tend to be sensitive to crosstalk - induced delay effects because of their short slack time 因此,超深亚微米工艺下,在设计验证、测试阶段需要对串扰问题给予认真对待。 |
| 3. | A resistance macromodel for deep - submicron process epi - type substrate based on the 2d device simulation is presented 摘要提出了一种基于二维器件模拟的深亚微米工艺外延型衬底的电阻宏模型。 |
| 4. | This thesis mainly addresses the design of 8 - bit cisc soft ip - 08c01 , based on dsm technology 本论文的主要工作是以8位微处理器软ip ? 08c01为载体,对基于深亚微米工艺的ip设计技术进行研究。 |
| 5. | Very large scale integrated circuit design is progressing rapidly in deep sub - micron technology , which has broken through the characteristic minimum size of 100nm 大规模集成电路设计正向深亚微米工艺不断推进,已经突破100nm大关。 |
| 6. | When deep into sub - micro process , some new problems have been detected , such as exponential increase of leakage power that leads to a series of significant hot topics 进入深亚微米工艺后,出现了很多新的功耗问题,例如漏电流的迅猛增长引起了一系列新问题的产生。 |
| 7. | Now the technology of integrated circuit industry has already broken through the characteristic minimum size of 100nm , and the cpu based on 90nm will be launched in this year 当前集电路产业已经突破100nm工艺大关,基于90纳米工艺的cpu处理器将于今年内推出,整个产业向深亚微米工艺不断推进。 |
| 8. | Besides , many newly emerging and specific deep sub - micron technology problems , which will significantly influence chip ' s performance , should be taken into account in modern eda design tools 现有eda工具难以应付复杂度呈指数增长的诸多vlsi设计难题,也缺乏对深亚微米工艺下一系列新问题的考虑。 |
| 9. | The research of this thesis contributes to the accumulation of the experience of ip design standardization for our country , and also provides the medium - scale ip ' s key technique based on the dsm technology 本论文的工作将不仅为国内ip标准化设计积累经验,而且提供了基于深亚微米工艺的中等规模ip设计的关键技术。 |
| 10. | The algorithm can quickly and accurately acquire the input signal , which is consistent with the real signal . the dissertation explains the algorithm to ascertain the cell working range and to choose characterization points 在分析深亚微米工艺下器件模型的基础上,文章推导了单元工作曲面范围的计算公式,给出了参数提取测试点的选择算法。 |