| 1. | Analysis on pad effects in chemical mechanical polishing
化学机械抛光中抛光垫作用分析 |
| 2. | Chemical mechanical polishing for mutilevel interconnect in ulsi
多层互连中的化学机械抛光工艺 |
| 3. | Chemical mechanical polishing planarization , cmp
化学机械抛光 |
| 4. | Corrosion and passivation of copper in the cmp slurry of ch3nh2 - k3 fe
铁氰化钾化学机械抛光液中的腐蚀与钝化 |
| 5. | Chemmically - mechanically polish
化学机械抛光 |
| 6. | Modeling of chemical mechanical polishing material removal based on molecular - scale mechanism
基于单分子层去除机理的芯片化学机械抛光材料去除模型 |
| 7. | Secondly , a novel technology is proposed which includes several key steps such as lpcvd ( low pressure chemical vapor deposition ) nitride silicon and cmp ( chemical mechanical polishing )
其次,设计包含低压淀积氮化硅和化学机械抛光( cmp )等关键步骤的新的soi介质隔离工艺流程。 |
| 8. | The analysed results show that the reasonable rotating speed np and distance e between workpiece plate center and polishing plate center are 60rpm and 100mm on ultra - precision surface polishing machine with correction rings , respectively
适合钽酸锂晶片化学机械抛光的抛光盘转速为n _ p = 60rpm ，工件盘中心到抛光盘中心的距离为e = 100mm 。 |
| 9. | Circularly translational - moving polishing ( ctp ) is a new type polishing method with best kinematics conditions of polishing , and can obtain better work efficiency and quality than the traditional cmp method
圆平动研抛( circularlytranslational - movingpolishing , ctp )是一种新型的化学机械抛光方式。 ctp能实现抛光所需要的最佳运动学条件,所以能得到比传统的cmp更好的加工效果。 |
| 10. | Chemical - mechanical - polishing ( cmp ) has been rapidly developing and finding extensive applications in the integrated circuit ( ic ) manufacturing industry for processing hard disk of computer and silicon wafer with super - smooth and flawless surface
集成电路( ic )制造工业中,化学机械抛光( chemicalmechanicalpolishing , cmp )广泛应用于计算机硬盘片、硅晶片超光滑无损伤表面的加工。 |
