| 1. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则 |
| 2. | Mechanical standardization of semiconductor devices - part 4 : coding system and classification into forms of package outlines for semiconductor device packages ; amendment 1
半导体器件的机械标准化.第4部分:半导体器件封装外形图类型的划分和编号系统.修改件1 |
| 3. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制的一般规则. p - vson的尺寸 |
| 4. | Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - dimensions of p - vson
半导体器件的机械标准化.第6部分:表面安装半导体器件封装外形图绘制的一般规则. p - vson的尺寸 |
| 5. | Mechanical standardization of semiconductor devices - part 6 - 10 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; dimensions of p - vson
半导体器件的机械标准化.第6 - 10部分:表面安装半导体器件封装外形图绘制的一般规则. p - vson的尺寸 |
| 6. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array
半导体器件机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小螺距球栅阵列的设计指南 |
| 7. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for gull - wing lead terminals
半导体器件的机械标准化.表面安装的半导体器件封装外形图绘制的一般规则.海鸥翼式铅端子的设计指南 |
| 8. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南 |
| 9. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array
半导体器件的机械标准化.绘制表面安装半导体器件封装外形图的一般规则.焊球网格阵列封装尺寸的测量方法 |
| 10. | Bga mechanical standardization of semiconductor devices - part 6 - 4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array
半导体装置的机械标准化.第6 - 4部分:表面安装半导体装置封装外形图绘制的一般规则.球状网格阵列 |
