| 1. | Specification for single and double sided carbon - coated printed boards without interlayer connection
无金属化孔单双面碳膜印制板规范 |
| 2. | Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification
印制电路板.层间连接刚性印制电路板.分规范 |
| 3. | Printed boards - part 4 : rigid multilayer printed boards with interlayer connections - sectional specification
印制电路板.第4部分:有扁导线的硬质多层印制电路板分规范 |
| 4. | Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.分规范 |
| 5. | Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification iec 62326 - 4 : 1996 ; german version en 62326 - 4 : 1997
印制电路板.第4部分:层间连接刚性多层印制电路板.分 |
| 6. | Printed boards - rigid multilayer printed boards with interlayer connections - sectional specification - capability detail specification - performance levels , a , b and c
印制电路板.层间连接刚性印制电路板.分规范.性能详细规格. a , b和c级性能水平 |
| 7. | Printed boards - part 4 : rigid multilayer printed boards with interlayer connections - sectional specification - section 1 : capability detail specification - performance levels a , b and c
印制板.第4部分:层连接的刚性多层印制板.分规范.第1节:性能详细规范.性能水平a b和c |
| 8. | Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification . section 1 : capability detail specification performance levels a , b and c
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.第1节:容量详细规范性能等级a b和c |
| 9. | Printed boards - part 4 : rigid multilayer printed boards with interlayer connections ; sectional specification ; section 1 : capability detail specification ; performance levels a , b and c iec 62326 - 4 - 1 : 1996 ; german version en 62326 - 4 - 1 : 1997
印制电路板.第4部分:层间连接刚性多层印制电路板.分 |
