| 1. | Mica tapes - polyimide film - backed mica paper tapes
云母带.聚酰亚胺薄膜粉云母带 |
| 2. | Adhesive coated polyimide film for flexible printed circuits
挠性印制电路用涂胶聚酰亚胺薄膜 |
| 3. | Evaluation of polyimide film developing level in china
我国聚酰亚胺薄膜制造技术发展水平的评估 |
| 4. | Copper - clad laminates for flexible printed wiring boards polyester film , polyimide film
柔性印制电路板用包铜层压板 |
| 5. | The effect on thermal stability of polyimide films based on phthalimide end - capped odpa and oda
聚酰亚胺薄膜热稳定性的影响 |
| 6. | Studies of the structural conversion and property change of polyimide film during the carbonization
膜碳化过程中结构和性能变化研究 |
| 7. | The dopping effect of nano - inorganic on structure and dielectric properties of polyimide films
无机纳米掺杂对聚酰亚胺薄膜的结构和介电性能影响 |
| 8. | Measuring the relative dielectric constant of dupont 100hn and 100cr polyimide film under optical frequency
两种聚酰亚胺薄膜光频相对介电常数的测定 |
| 9. | Base material for printed circuits - specifications - flexible copper - clad polyimide film , general purpose grade
印制电路板基材.第2部分:规范.第13节:通用柔性覆铜聚酰亚胺膜 |
| 10. | Thermal expand coefficient of polyimide films at each temperature was measured in the process of thermal cycling
摘要测量了聚酰亚胺薄膜在冷热循环过程中各温度点的热膨胀系数。 |
