| 1. | Formation of electroplated solder bumps in wafer level packaging
焊料凸点制作工艺 |
| 2. | Lead - free solder bumping technology for wafer level package
圆片级封装的无铅焊料凸点制作技术研究 |
| 3. | Current research on the reaction between solder bump and under bump metallurgy systems in flip chip
倒装芯片中凸点与凸点下金属层反应的研究现状 |
| 4. | During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure
在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。 |
| 5. | As an electric current passes through , the joule heating and electromigration effects occur in the flip chip solder bumps
当电流通过焊点时，会伴随产生焦耳热效应和电迁移效应。 |
| 6. | With the trend toward miniaturization , solder bumps are getting smaller , and the electric current loading of each solder bump is getting higher
随著电子产品之微小化，焊料凸块的尺寸越来越小，而焊料凸块的电流密度也随之增大。 |
| 7. | It is also found that the geometry of a flip - chip joint and void formation have stronger effects upon current crowding than the multi - phase nature of solder bumps does
在本研究亦发现，覆晶接点的几何形状和孔洞对于电流聚集有很大的影响，其效应远胜于焊料中的多相结构。 |
