| 1. | The status and development of ccl main equipment
覆铜板设备的发展及现状 |
| 2. | Poly phenylene oxide epoxy system ppo ep and its application in copper clad laminate
环氧树脂体系在覆铜板中的应用 |
| 3. | Copper - clad board maerial
覆铜板材料： |
| 4. | Uses : it is used for manufacturing copper - clad r . p . panel and widely used in electric ' s industry
用途2可供制造覆铜板，广泛应用于电子、电器行业。 |
| 5. | Uses : it is used for manufacturing copper - clad r . p . panel and widely used in electric ' s industry
用途2 ：可供制造覆铜板，广泛应用于电子、电器以及玻璃钢行业。 |
| 6. | Single sided - fpc this product is pressed with one layer of flexible copper - clad panel and one layer of flexible solder coating
柔性单面线路板是由一层柔性覆铜板和一层柔性阻焊覆盖膜压合而成。 |
| 7. | This product is a result of the developing of more and more complicated circuits . it can be made by pressing solder coating to both sides of a double - sided copper - clad panel
双面柔性电路板是随着线路的不断复杂化而诞生的，可以由双面覆铜板同时压制两面的阻焊覆盖膜制造而成。 |
| 8. | To summarize : use double - sided copper - clad boards with maximum ground area and heavy , well - located power - supply and ground - return leads . tie rounds together locally
作个归纳：用双面覆铜板并使地面积最大，用粗线作为选位合适的电源线及其返回地线的接线。将局部地线连接在一起。 |
| 9. | Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for copper foil for use in the manufacture of copper - clad base materials
印制电路板用覆箔板.第103部分:印刷电路连接专用材料.第2节:覆铜板制造用铜箔规范 |
| 10. | Our company is a large joint venture company , mainly produce electrolytic copper foil and copper clad laminated sheet . it has got iso9002 , ul , bsi and china great wall secure recogonition
简介：本公司是一中外合资大型企业，主要产品有电解铜箔、覆铜板，年产电解铜箔5000吨，覆铜板500万平方米，公司已通过了iso9002认证。 |
