| 1. | Effect of curing agents and curing conditions on intercalation and exfoliation behavior of epoxy clay nanocomposite
粘土纳米复合材料插层剥离行为的影响 |
| 2. | Various curing condition and different amount of water evaporated in early - age curing would lead to different strength of concrete
早期养护条件不同，混凝土失水量不同，则混凝土中后期强度也不相同。 |
| 3. | Abnormal setting of concrete and improper control of curing condition is two important factors affecting the quality of concrete
混凝土不正常凝结和养护条件控制不力是影响混凝土工程质量的两个重要方面。 |
| 4. | Moreover , the results indicate that the curing condition of this type concrete is very strict and it is necessary to strengthen its early curing in water
同时，研究表明，超高强补偿收缩混凝土对养护的要求极为苛刻。加强超高强混凝土的早期水养护尤其重要。 |
| 5. | Low temperature flexible , easily pourable rtv silicone sealant / encapsulant , can be used with a wide variety of curing agents , thus varying pot life , cure time , mix ratios and cure conditions
低温弹性，易浇注的rtv密封硅胶，可与多种固化剂使用，可改变灌胶时间、固化时间、混合比率以及固化条件。 |
| 6. | Using the technology of environmental scanning electron microscope , the microstructure of rpc was preliminarily studied to analyze the reasons for the difference of mechanics performance in the different curing conditions
利用环境扫描电子显微镜（ esem ）技术，对rpc200的微观结构进行了初步研究，分析rpc200在不同养护方法下力学性能产生差异的原因。 |
| 7. | We studied mix properties , mechanical properties and durability of polymer modified mortar under suited curing conditions compared with common mortar . the mortar cracking status was measured by use of the equipment of steel ring
根据最终所确定的聚合物种类和掺量,配制聚合物改性砂浆,在最合适的养护制度下养护,研究聚合物改性砂浆的拌合物性能、力学性能和耐久性能等,并与普通砂浆进行对比研究。 |
| 8. | Low viscosity , excellent electrical properties , used extensively as a high voltage potting compound as well as an encapsulating compound for delicate circuitry , can be used with various curing agents , thus varying pot life , cure time , mix ratios and cure conditions
低粘度，有着出色的电气性能，广泛地应用为高压灌封化合物和精密电路密封化合物，可与多种催化剂使用，可改变灌胶时间、固化时间、混合比率以及固化条件。 |
| 9. | The characteristics of ito films prior to and post the pi and hot - press heating cure in the manufacturing processes of lcd have been researched to provide guidance for selecting lcd flat panel and enacting of pi and hot - press heating cure conditions in the processes design
研究了ito导电膜在lcd工艺流程中pi高温固化热处理前后和热压固化热处理前后的电性能特性，为工艺设计中lcd基材的选配及pi 、热压固化条件的设定提供指导。 |
| 10. | The curing conditions were studied and the result indicated that the product showed a good storage , decreased the curing temperature , improved adhesion and brittleness , with an excellent film performance . expecially the adadhesion , flexibility and chemicol resistance
结果表明，合成的交联剂贮存性能良好，醚化三聚氰胺树酯作为交联利加入到丙烯酸环氧树酯中,可以明显降低固化温度且改善原有涂膜的脆性，成膜性能好，尤其是具有优良的附着力、柔韧性和耐化学品性。 |
