| 1. | Requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
电子钎焊用电子级钎料合金及助熔和非助熔固体钎料的要求 |
| 2. | Attachment materials for electronic assembly - requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
电子组件用的连接材料.电子焊接设备用的电子分级焊料合金和助熔剂和非助熔剂的要求 |
| 3. | Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
电子组件用连接材料.第1 - 3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料的要求 |
| 4. | Attachment materials for electronic assembly - part 1 - 3 : requirements for electronic grade solder alloys and fluxed and non - fluxed solid solders for electronic soldering applications
电子组件用连接材料.第1 - 3部分:电子焊接用电子级钎焊合金及有焊剂和无焊剂的固体焊料的要求 |
| 5. | The technological capabilities of electronic solders were presented through analysis the action of solders in the soldering process , which includes temperature of melting or solidifying , anti - oxidation capability , wetability and overflow capability
摘要通过分析焊料在钎焊过程中的行为，提出了电子焊料的工艺性能主要包括熔化固化温度、抗氧化性、润湿性和漫流性。 |
| 6. | The analysis results indicate that the correlative influence factors to the technological capabilities of electronic solders include the composition and purity and chemical uniformity of solder alloy , the composition and properties of mother materials and their clean level on the surface , the surface tension of liquid state solders , the temperature and atmosphere in soldering and the activity of flux , the chemical composition and structure and properties of the surface film of melting solders , and so on
分析表明：相关的影响因素主要包括合金的组成、纯度和化学均匀性；母材的成分、性质和表面的洁净度；液态焊料的表面张力；钎焊温度、气氛、助焊剂的活性；液态焊料表面膜的组成、结构和性能等。 |
