| 1. | Metal - clad base material
履金属箔基材 |
| 2. | Specification for metal - clad base materials for printed circuits - silicone woven glass fabric copper - clad laminated sheet si - gc - cu - 13
印制电路板用覆箔板.第13部分:硅酮玻璃布覆铜层压板si - gc - cu - 13 |
| 3. | Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for copper foil for use in the manufacture of copper - clad base materials
印制电路板用覆箔板.第103部分:印刷电路连接专用材料.第2节:覆铜板制造用铜箔规范 |
| 4. | Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for permanent polymer coating materials solder resist for use in the fabrication of printed boards
印制电路用基材.第103部分:印制电路连接专用材料.第3节:制造印制电路板用永久性聚合物表面涂覆剂 |
| 5. | Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board
印制电路板用覆箔板.第103部分:印制电路连接专用材料.第1节:多层印制电路板制造用粘结片材的半固化片规范 |
