A new method for calculating the strain energy release rate of delamination crack propagation at an interface between dissimlar materials was suggested by using the j - integral with a small flat rectangular contour near the crack tip 提出了一种通过特定的扁平小矩形路径j积分，计算电子封装中异质界面分层裂缝扩展能量释放率的新方法。
