| 1. | Bga transform and insulating substrate technology
焊球阵列转变与绝缘基板技术 |
| 2. | Bga enters mainstream of the contemporary assembly technology
技术成为现代组装技术的主流 |
| 3. | Bga test technology amp; amp; quality control
焊点的质量控制 |
| 4. | Quality control of bga solder joint
检测技术与质量控制 |
| 5. | Fc - bga flip - chip ball grid array
反转芯片球形栅格阵列 |
| 6. | Overall design of soldering and smd / bga desoldering function
全面性维修设计,包括焊接及smd / bga拆焊双功能。 |
| 7. | Plastic - bga pbga
塑胶质球脚封装体 |
| 8. | Packaged in bga and pga
封装形式： |
| 9. | Bga ball grid array
球状网阵排列 |
| 10. | Bga ball grid array
球状矩阵排列 |
