English translation for "cu-al"
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- 一种
Related Translations:
- Example Sentences:
| 1. | Preparation of single crystal cu - al based shape memory alloy
系形状记忆合金制备研究 | | 2. | Property of cu - al functional gradient material
梯度功能材料性能研究 | | 3. | In this paper , metastable cu - al alloy powder with different aluminum content was prepared by mechanical alloying technique . high strength and high conductivity cu - al2c > 3 composites were prepared by a new type vacuum internal oxidation technique
本文采用机械合金化法制备了不同铝含量的亚稳态的cu - al合金粉末，采用新型真空内氧化工艺制备了不同成分的高强度高导电cu - al2o3复合材料。 | | 4. | Two types of internal oxidation techniques were adopted , namely internal oxidation under nitrogen protect and new type vacuum internal oxidation in the present study . both techniques can achieve the oxygen partial pressure that the internal oxidation reaction of cu - al alloy can take place
本文采用的两种内氧化工艺，即氮气保护下的内氧化和新型真空内氧化工艺，都可以满足cu - al合金发生内氧化的气氛条件。 | | 5. | After the cu - al mixed powder was milled 96h , the lattice constant of cu ( 111 ) plane became 0 . 3653nm , and the diffraction peaks of aluminum have disappeared completely , which showed that aluminum atoms have dissolved in crystal lattice of copper
当cu - al混合粉末球磨时间大于96h时， cu的( 111 )面的点阵常数变为0 . 3653nm ， al的衍射峰已完全消失。通过分析可知，经过96h的球磨， al原子已经完全吲溶于cu的晶格中。 | | 6. | The condition which the internal oxidation reaction of cu - al alloy can take place has been studied ; technique parameters have been set on the basis of theoretical analyze ; different factors which can affect the microstructure and properties of cu - al2o3 composites have also been discussed . the ambient temperature properties and the thermal stability of composites were tested . several electrical conductivity models were optimally selected to calculate the electrical conductivity of cu - ahoa composites . the results showed that : 1
研究了cu - al系合金粉末发生内氧化所需的条件，根据理论分析制定出相应的工艺参数；分析研究了各种影响cu - al2o3复合材料组织与性能的因素；测试了本课题制备的cu - al2o3复合材料的室温性能，热稳定性能；优选了适合cu - al2o3复合材料的电导模型。 | | 7. | A reliability experiment of thermal aging was carried out for the two types of joints , scanning electron microscopy , energy dispersive x - ray spectrometer and micro x - ray diffractomer were adopted to investigate the interfacial evolution behavior of joints , and kinetics model of imc formation was established . the results show that imc growth follows the parabolic law as a function of aging time at certain aging temperature , imc growth is more sensitive to the aging temperature than the aging time , the activation energy of cu - al imc growth is 97 . 1kj / mol and the major forming cu - al imc are cual2 and cu9al4 , the activation energy of au - al imc growth is 40 . 1kj / mol and the main au - al imc are au4al and au5al2 , with au2al and aual at the interfacial periphery of joints , the rate of cu - al imc growth is about 1000 times slower than that of au - al imc , and kirkendall voids and cracks are easily appeared during thermal aging in gold ball bonds while voids and cracks are absent in copper ball bonds even after aging at 200 for 2900 hours and 250 for 169 hours
研究结果表明:金属间化合物厚度与老化时间的关系符合抛物线法则,金属间化合物的生长对老化温度比老化时间更加敏感; cu - al金属间化合物生长的激活能为97 . 1kj / mol ,老化后金属间化合物呈层状分布,主要相为cual2和cu9al4 ; au - al金属间化合物生长的激活能为40 . 1kj / mol ,主要相为au4al和au5al2 ,同时在界面周边区域生成了au2al和aual ;老化过程中cu - al金属间化合物生长速率比au - al金属间化合物生长速率小103数量级;金丝球键合点200老化96小时出现了明显的kirkendall空洞和裂纹,但铜丝球键合点200老化2900小时和250老化169小时都没有形成空洞和裂纹。 |
- Similar Words：
- "cu yd" English translation, "cu zn gel" English translation, "cu(e=150)" English translation, "cu-050" English translation, "cu-71xc2" English translation, "cu-base alloy" English translation, "cu-be electron multiplier" English translation, "cu-cooling plate" English translation, "cu-free solution" English translation, "cu-interconnect technology" English translation
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