Cobalt - tungsten electrodeposit as copper barrier was presented in the paper 本文提出以电镀钴钨二元合金镀层作为防铜渗层。
2.
Gold electrodeposit as top coating of artificial jewelry made of copper and copper alloy tarnished because of copper diffusion to gold top deposit 铜和铜合金饰品表面需镀金，由于铜扩散至镀金层表面，引起金层变色。
3.
1 . the composition and current efficiency of ni - w - b electrodeposit in the bath containing ammonium citrate as complexing agent were related to the deposition current density and bath composition 在以柠檬酸铵为络合剂的镀液中， ni - w - b合金电沉积层的组成和沉积电流效率与沉积电流密度及镀液的组成等有关。
