| 1. | Mcm flip - chip - bonding technique used in fabrication of cmos - s eed smart pixel
灵巧象素中的应用研究 |
| 2. | Fc - bga flip - chip ball grid array
反转芯片球形栅格阵列 |
| 3. | Fc - pga flip - chip pin grid array
反转芯片针脚栅格阵列 |
| 4. | Flip - chip bonding technology
的柔性凸点技术 |
| 5. | Design and realization of machine vision system in thermosonic flip - chip bonder
热超声倒装键合机视觉系统的设计与实现 |
| 6. | It is found that the highest consumption rates of barrier layers in certain parts of flip - chip joints are related to the current crowding phenomena
结果发现在覆晶接点中，障层的消耗速率和电流聚集的位置有密切关联。 |
| 7. | It is also found that the geometry of a flip - chip joint and void formation have stronger effects upon current crowding than the multi - phase nature of solder bumps does
在本研究亦发现，覆晶接点的几何形状和孔洞对于电流聚集有很大的影响，其效应远胜于焊料中的多相结构。 |
| 8. | Manufactures metallized ceramic packages for rf microwave devices , multilayer ceramic and organic material ic packages and offers flip - chip , wire - bond semiconductor and electronic plating services
-一家专业研制生产销售系列高稳晶体振荡器和开关电源产品的高科技企业。 |
| 9. | The assembly process and experimental results are included in this paper . in order to increase the power density of the module , a three - dimensional fc - ipem package structure is introduced . a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique
为实现更高的功率密度，本文把微电子行业中广泛应用的倒装芯片技术应用于模块电源研究中，完成了一个半桥fc - ipem ( flipchip - integratedpowerelectronicsmodule )模块。 |
| 10. | In the second part , the reliability research on electronic packaging was concentrated with finite element method ( fem ) on moisture diffusion in plastic materials , die cracking of flip - chip with no - flow underfill and thermal performance of high power electronic components . in the last chapter , the design tool for advanced electronic package was studied . the main conclusions in the second part are as follows
论文第二部分电子封装可靠性研究包含对塑封材料中水汽扩散研究、填充不流动胶的倒装焊芯片可靠性研究以及大功率器件散热问题研究三方面内容，最后为实现封装设计标准化和自动化，研究了若干最主要的电子封装构型的参数化有限元建模、加载和相应的求解方法。 |
