| 1. | Heatsink eff decreases with height above sealevel
散热片的作用随着海拔增加而降低。 |
| 2. | It ' s actually hiding a heatsink and fan that draws hot air thru its vents
标志下藏着一个散热槽和风扇，通过上面的通风口抽走热空气。 |
| 3. | According to heat transfer and hydrodynamics , the thermal flow dynamics and the thermal resistance microchannel heatsink are analyzed
根据传热学和流体力学理论，本论文对微通道热沉进行了热流模型分析，理论推导了微通道热沉的热阻。 |
| 4. | A low noise , high cfm fan channeled through our sleek looking , uniquely designed casing helps direct heat away while focusing more air through the heatsink
低噪音，高风量，多方向排风风扇设计，独特的外壳设计使热量彻底的直接排出。 |
| 5. | Based on the analysis , the heat sink materials , cooling liquid , the heatsink structure , and the bonding of laser bar are optimized in order to increase the transfer efficiency
通过分析，对微通道热沉材料、冷却液、微通道热沉的结构参数以及热沉与激光器列阵条的封装等进行了优化设计。 |
| 6. | By testing , the total thermal of the microchannel heatsink for cooling high power semiconductor diode laser arrays is 0 . 645 / w , which is consistent with the result of theory counting
通过测试，所制得的无氧铜微通道热沉冷却半导体激光器的总热阻为0 . 645 ~ 0c w ，与理论分析基本吻合，满足散热要求。 |
| 7. | In order to increase the output power , reliability and stabilization , microchannel heatsink which is one of active heatsinks is used to cool high power semiconductor diode laser arrays in the paper
为了提高激光器的输出功率、可靠性和稳定性，本论文选取有源热沉? ?微通道热沉来冷却大功率半导体激光器列阵。 |
| 8. | Considering the practical manufacturing condition , an oxygen - free copper microchannel heatsink consisting of five copper sheets is designed and fabricated utilizing the technology of deep photolithography , mechanical machining , and bonding with medium
根据实际制作条件，设计了五层结构微通道热沉，采用深层光刻分离曝光化学腐蚀技术、机械加工技术和铜直接粘接技术( dbc )制备出冷却大功率半导体激光器迭阵的无氧铜微通道热沉。 |
