| 1. | Specification for adhesives in hybrid microcircuits
混合微电路用胶粘剂规范 |
| 2. | Microcircuits . digital microcircuits . general requirements
微电路.数字微电路.一般要求 |
| 3. | General specification for microcircuit modules
微电路模块总规范 |
| 4. | Microcircuits . digital microcircuits . fusible link prom memories
微电路.数字微电路.可熔链路程序存储器 |
| 5. | Analysis and control of moisture content in microcircuit manufactured packages
知识经济下的管理变革与创新 |
| 6. | Test method for hermeticity of hybrid microcircuit packages prior to lidding
混合微电路组件在封装前的密封性的试验方法 |
| 7. | Microcircuits . screening procedures for integrated circuits . general requirements
微电路.集成电路用屏蔽程序.一般要求 |
| 8. | This microcircuit , whose parts are too small to be seen , was made in america
这个微型电路是美国制的，其零件小得看不见。 |
| 9. | Hybrid microcircuits . film deposit resistive integrated circuits . general requirements
混合微电路.薄膜附着电阻集成电路.一般要求 |
| 10. | Test method for combined fine and gross leaks for large hybrid microcircuit packages
大型混合微电路插件的综合微泄漏和总泄漏的试验方法 |
