Mobile
Log In Sign Up
Home > chinese-english > "packaged-design" in English

English translation for "packaged-design"

组装结构

Related Translations:
disposable packaging:  不回收包装使用一次包装
package plant:  包装厂移动式水处理装置移动式污水处理装置整体系统;小型处理系统
multipin package:  多插脚外壳
outer package:  户外场所外包装
package mill:  打包带钢轧机打包用带钢轧机
segment package:  段封装
subroutine package:  子程序包
packaging signal:  包装信号
package terminal:  封装引出端子封装引出线
package styles:  包装样式
Example Sentences:
1.Packaging - paper and paperboard packaging - design of cartons
包装.纸和纸板包装.纸板箱的设计
2.Packaging - paper and paperboard packaging - design of cartons
包装.纸和纸板包装.纸板箱的设计
3.Packaging - paper and paperboard packaging - design of cartons ; german version en 14054 : 2003
包装.纸和纸板包装.纸板箱的设计
4.Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitchball grid array
半导体器件机械标准化.表面安装半导体器件封装外形图绘制的一般规则.小螺距球栅阵列的设计指南
5.Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for gull - wing lead terminals
半导体器件的机械标准化.表面安装的半导体器件封装外形图绘制的一般规则.海鸥翼式铅端子的设计指南
6.Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南
7.Flga . mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch land grid array - rectangular type
半导体装置的机械标准化.表面安装的半导体器件封装图形图绘制的一般规则.细微间距栅级阵列
8.Mechanical standardization of semiconductor devices - part 6 - 6 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine pitch land grid array
半导体器件的机械标准化.第6 - 6部分:半导体器件包装用表面安装略图制备的一般规则.小螺距刃片栅格排列的设计指南
9.Mechanical standardization of semiconductor devices - part 6 - 5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch ball grid array
半导体器件的机械标准化.第6 - 5部分:半导体器件包装用表面安装略图制备的一般规则.小螺距球面栅格排列的设计指南
10.Mechanical standardization of semiconductor devices - part 6 - 12 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for fine - pitch grid array - rectangular type
半导体装置的机械标准化.第6 - 12部分:表面安装半导体装置外形图绘制的一般规则.小节距栅极矩阵列的设计指南.矩形
Similar Words:
"packaged vacuum unit" English translation, "packaged water source" English translation, "packaged waterflood installation" English translation, "packaged waterflood plant" English translation, "packaged well servicing system" English translation, "packagedairconditioner" English translation, "packageholiday" English translation, "packageirradiationplant" English translation, "packageless integrated microcircuit" English translation, "packagen" English translation