| 1. | Bismaleimide triazine epoxide woven glass fabric copper - clad lamimates
双马来酰亚胺三嗪环氧玻璃布覆铜箔板 |
| 2. | S - triazine pesticides are rapidly becoming of increasing importance to agriculture
S -三氮朵苯农药对农业生产变得越来越重要。 |
| 3. | Prepreg for multilayer printed wiring boards - bismaleimide triazine epoxide resin - impregnated glass cloth
多层印制线路板用半固化片. bismaleimide三氮杂苯环氧树脂浸渍玻璃布 |
| 4. | Bismaleimide specifications - specification no . 19 - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规范.第19号规范.制造多层印制板用的规定可燃性能的薄比斯玛勒米德 |
| 5. | Bismaleimide base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印制电路用基材.第2部分:规范.第18号规范:规定易燃性的比斯玛勒米德 |
| 6. | Specifications . specification no . 19 . thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
规范.第19号规范:多层印制电路板构件规定的可燃性双马来酰亚胺三嗪改型氧化物玻璃纤维编织包铜叠层板材 |
| 7. | Base materials for printed circuits - thin bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
印制电路用基体材料.用于多层印制板构成的限定可燃性的薄双马来酰亚胺三嗪改性的环氧织物玻璃纤维包铜层压板 |
| 8. | Base materials for printed circuits . part 2 : specifications . specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷电路用基材.第2部分:规范. 18号规范:规定易燃性的双马来酰亚胺三嗪改良型环氧化合物机织玻璃纤维织物包铜层压板 |
| 9. | Base materials for printed circuits . part 2 : specifications - specification number 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test
印刷电路用基材.第2部分:规范. 18号规范.规定易燃性的双马来酰亚胺三嗪改良型环氧化合物机织玻璃纤维织物包铜层压板 |
| 10. | . 1 base materials for printed circuits ; part 2 : specifications ; specification 18 : bismaleimide triazine modified epoxide woven glass fabric copper - clad laminated sheet of defined flammability vertical burning test ; amendment 1
印制电路用基材.第2部分:规范.第18号规范:规定易燃性的双对马来酰压胺三氮杂苯改良型环氧玻璃纤维编织覆铜层压板 |
