| 1. | Familiar with deep submicron process design rule
熟悉深亚微米工艺设计规则。 |
| 2. | Submicron domain patterning in linbo3 doped mgo
掺镁铌酸锂晶体亚微米畴结构特性研究 |
| 3. | The size of silver particles was between 50nm and 400nm
粒径为300urn的亚微米以。 |
| 4. | Interconnect wire delay questions in deep submicron ic design
深亚微米集成电路设计中的互连线延迟问题 |
| 5. | Numerical simulation of air sliders in an ultra sub - micron flying system
深亚微米飞行系统滑块的数值仿真 |
| 6. | Research on the stimulated raman spectrum in submicro - diameter fiber
亚微米直径光纤的受激拉曼谱特性研究 |
| 7. | Nanoindentation and nanoscratch measurements on sub - micron tin coatings
亚微米氮化钛膜的纳米压痕和划痕测定 |
| 8. | Adhesion measuring of copper coating on stainless steel by indentation test
亚微米铜薄膜界面结合强度的测定 |
| 9. | Preparation and tensile strength of pa 6 tio2 composite sub - micro fibers
2复合亚微米级纤维的制备及拉伸性能 |
| 10. | Standard sub micron grade for solid rotary tool applications
是适用于可转位工具的晶粒度为亚微米级的标准牌号。 |
