| 1. | Fundamental parameters of connectors for printed wiring boards
印制线路板连接器的基本参数 |
| 2. | Printed wiring boards - guide for the specification writer
印制线路板.第1部分:规范编制导则 |
| 3. | Printed wiring boards - guide for the production of artwork
印制线路板.第24部分:照相原图制作指南 |
| 4. | Printed wiring boards - guide to the rework of unassembled boards
印制线路板.非安装板的再加工指南 |
| 5. | Multilayer printed circuit board
多层印制线路板 |
| 6. | Guidelines for selecting core constructions for multilayer printed wiring boards
多层印制线路板的选择芯结构指南 |
| 7. | Be suitable in the field of printed circuit board , connector and semiconductor
主要应用于印制线路板,接插件及半导体领域。 |
| 8. | Be suitable in the field of connector , printed circuit board and semiconductor
主要应用于接插件，印制线路板及半导体领域。 |
| 9. | Evaluation of uncertainty of determination of pbbs and pbdes in printed wiring boards by gc ms
质谱联用法测定印制线路板中多溴联苯及多溴联苯醚的不确定度评估 |
| 10. | Prepreg for multilayer printed wiring boards - bismaleimide triazine epoxide resin - impregnated glass cloth
多层印制线路板用半固化片. bismaleimide三氮杂苯环氧树脂浸渍玻璃布 |
