| 1. | Relocate and or modify gate size width thickness ratio or gate land
重新放置浇口位置和或修改其尺寸宽厚度比 |
| 2. | Thickness ratio of rudder
舵的厚度比 |
| 3. | The outer tangential wall of no - nodules legume plants epidermal cells is thicker and darker than that of nodule legume plants
非结瘤豆科植物的根表皮细胞外切向壁的厚度比结瘤豆科植物的要厚，颜色也较深。 |
| 4. | The shape of the fender is composed of three inter - vertical planes , which were only 3mm thick , but the length is more than 200mm . so it is a complicate product with superior length / thickness ratio
该挡泥板由三个相互垂直面组成，产品厚度仅为3mm ，但高度最大达到了约200mm ，是一种超高度厚度比的复杂制品。 |
| 5. | Atlas of stress distribution and graphs of stress concentration factor ( scf ) were obtained . the atlas and the graphs showed that the scf at the joint crease nonlinearly with the accretion of r / r and the minuet of t / t
结果表明连接点处有明显的应力集中，并且这种应力集中是随着开孔率增大和厚度比减小呈现非线性增长的。 |
| 6. | Through these studies , preliminary results and understandings have been gained as follows : 1 ) propose a reverse - appraisal method that is more reliable based on imaging well log data to classify the lava flow orientations of volcanic rock facies , integrating with lava - debris thickness ratio
通过研究，初步获得的成果和认识如下： 1提出了依据成像测井资料，划分火山岩岩相的熔岩流向反推法，结合火山熔岩与碎屑岩厚度比法，划分结果更可靠。 |
| 7. | Being based on actual multi - chips module packaging structure a three dimensional thermal analysis model is built , thermal analysis on multi - chips module is conducted using diamond substrate and thermal interfacial materials ; a two dimensional and three dimensional chip - adhesive ? substrate thermal stress model are built , and interfacial thermal stress distributions are computed based on different area ratios and thickness ratios of substrate to chip
本文根据实际的多芯片组件的封装结构,建立了三维温度场分析模型,分析了金刚石作为导热层和基板对多芯片组件散热性能的改善;建立了二维和三维的芯片-粘结层-基板热力学模型,分析了不同的基板/芯片厚度比和面积比对层间热应力分布的影响。 |
| 8. | It is important to analyze the stresses and reinforcement design of spherical shell with transnormal nozzle because it is widely used in petroleum > chemicak nuclear electric and other industries . first of all , in order to explore and master the characteristic of stress distribution on this structure and to find reinforcement design which can accommodate to different instances , the stresses of a series of models with different t / t and r / r were analyzed by the finite element procedure - ansys
首先，为了更进一步了解和掌握球壳超标开孔平齐接管结构的应力分布特点，并找到适用于不同情况下的补强设计方法，本文利用ansys有限元分析计算程序对不同开孔率和不同厚度比的一系列球壳超标开孔平齐接管结构进行了应力分析，得到了应力分布曲线和应力集中系数曲线。 |
| 9. | Generally , the membrane thickness is much larger than the pore dimension . therefore , the resistance of the pore channel was the control resistance of the membrane diffusion process . while the existences of the stephen diffusion and pore interaction well explained the reason why the total membrane surface would be used as the interfacial area through where the mass transport took place
尽管由于膜的厚度比孔的尺寸要大很多， stephen扩散以及孔之间的相互作用对通过膜的总扩散阻力影响很小，但它们存在的结果是使整个膜表面的气体浓度趋于一致。 |
| 10. | In the april s issue arteriosclerosis thrombosis and vascular biology , published by the american heart association , professor woo found that in 228 healthy subjects who have neither heart disease or diabetes but with " high normal " glycemia levels ( or with a number of components of metabolic syndrome ) , carotid intima - media thickening , an important marker for arteriosclerosis , was observed
胡教授在《动脉硬化、栓塞和血管生物杂志》 （ arteriosclerosis , thrombosis , vascularbiology ）的文章中指出：在228位尚未发现有心血管疾病亦未诊断为糖尿病患者的健康人中，血糖水平在正常界域但稍偏高（或兼有某些代谢综合症） ，其颈动脉内中膜厚度比其他正常人增厚，这是血管硬化病变的一个重要标示。 |
