| 1. | The substrate is first covered by a mask .
首先在基片上覆盖一个掩膜片。 |
| 2. | The reactors for this type of deposition are easily scaled to accommodate 125-or 150-mm wafers .
这种淀积反应器很容易达到适应125或150mm的基片。 |
| 3. | The major advantages of these reactions are excellent uniformity, large load size, and ability to accommodate large diameter wafers .
这种反应器的主要优点是优越的均匀性，较大的负载量及适应大直径基片的能力。 |
| 4. | Alumina ceramic substrates for thin film integratedcircuits
薄膜集成电路用氧化铝陶瓷基片 |
| 5. | Alumina ceramic substrates for microwave integrated circuits
微波集成电路用氧化铝陶瓷基片 |
| 6. | Alumina ceramic substrates for thick film integratedcircuits
厚膜集成电路用氧化铝陶瓷基片 |
| 7. | Fluoroplastic coating film on metal substrate
金属基片的氟塑料涂层膜 |
| 8. | Porcelain enameled steel substrate for hybrid integrated circuits
混合集成电路用被釉钢基片 |
| 9. | Self - organized zno thin film design and morphology control
基片与膜厚对硬质薄膜力学性能的影响 |
| 10. | Microwave composite dielectric substrate
复合微波介质基片 |
