| 1. | Research on soi pressure sensor packaging process
压力传感器封装工艺研究 |
| 2. | A few new packaging technologies
几种新的封装工艺 |
| 3. | Assembly process and product reliability assurance system in samsung suzhou semiconductor
苏州三星半导体封装工艺及产品可靠性保障体系 |
| 4. | This product design for ic assembly die attache process on die bonder machine
本产品为ic集成电路封装工艺芯片全自动固晶机上而专门设计。 |
| 5. | Lanke s quality policy is to earn customer loyalty by providing products and services of satisfying quality and value
不断改进封装工艺，提高产品质量，降低成本，现在蓝白光led占到公司产量的一半以上。 |
| 6. | Adopting international leading manufacturing and encapsulating techniques , the panels are made of excellent imported solar cells , and have excellent output performance
采用国际领先的生产技术和封装工艺，精选优质太阳能电池片制作而成，具有良好的输出特性。 |
| 7. | This series products adopt surface package modularization craft , output loops all adopt photoelectric isolation , independently supply , have improved anti - reference ability
本系列产品采用表面封装工艺，大大提高了仪表的抗干扰能力，具有显示控制变送通讯万能信号输入等功能。 |
| 8. | Lanke collaborates with partners , customers , and employees to produce qualified products and services that make a sound contribution to our customers by using clear standards of business conduct and total quality management practices
公司的led普通管的质量良品率达到50ppm ，产品的整体工艺控制非常严格，对工艺原理研究比较深入，积累了独到的封装工艺技术和经验。 |
| 9. | Among all kinds of demultiplexers , etched diffraction gratings ( edgs ) are regarded as one of the most potential types of planar waveguide wdm devices . this phd thesis focuses on the design , simulation and fabrication of edgs for optical communications
蚀刻衍射光栅是采用平面波导技术制成的集成密集波分复用器件，它具有信道损耗低、串扰小、器件尺寸小、容易扩展信道、制作和封装工艺相对简单等优点。 |
| 10. | Through analyzing constitute and mechanism of high power laser diode ( ld ) fiber coupling module , the effects on reliability of ld fiber coupling module are detailed as following : crafts of coupling and encapsulation , electricity factors and ld itself
摘要文章从高功率半导体激光器光纤耦合模块的组成和各个部分的机理出发，详细分析了影响其可靠性的因素，主要有以下三个方面：激光器自身的因素、耦合封装工艺和电学因素。 |
