Specification of leadframes for plastic quad flat package 塑料四面引线扁平封装引线框架规范
2.
Quad flat package qfp 四列扁平封装
3.
Ceramic flat package 陶瓷扁平封装
4.
Chip carrier sockets for plastic quad flat packages for use in electronic equipment , blank detail specification for 电子设备用塑料方形扁平封装用片式载体插座的空白详细规范
5.
Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack 半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南
