| 1. | The dynamic fracture and fragmentation of ofhc cu under 1 - d fast tension
一维快速拉伸下无氧铜的动态断裂与破碎 |
| 2. | Standard specification for oxygen - free copper in wrought forms for electron devices
电气设备用锻造成形无氧铜标准规范 |
| 3. | Ofc oxygen - free cupreous
无氧铜导线 |
| 4. | Specification for oxygen - free high - conductivity copper for electronic tubes and semiconductor devices
电子管及半导体器件用高导电率无氧铜规范 |
| 5. | Welcome to liweilong our products : oxygen - free copper bar , hypoxic copper bar , various sizes of copper wires
我们的产品：无氧铜杆低氧铜杆各种规格铜线 |
| 6. | Invented an evaporation boat with new structure . solve the evaporation problem of vopc
提出了一种新型结构的无氧铜蒸发舟，有效的解决了有机材料vopc的蒸发问题。 |
| 7. | Oxygen free copper sheets , plates , strips , seamless pipes and tubes , rods , bars and wires for electron devices
电子设备用无氧铜薄片板材带材无缝钢管杆材棒材和线材 |
| 8. | The 3 - d numerical simulation shows that the temperature rise of necking region is higher than that of no - necking region
对无氧铜在破碎前出现塑性失稳多重颈缩进行了初步分析，利用能量平衡的破碎理论给出了无氧铜环的破碎分布。 |
| 9. | Thermodynamic computation indicates that copper melt at the final release state ( 1 atm ) in the shock pressure range from 148gpato 219gpa . method 2 : lagrange wave speed measurement
由热力学计算得出，无氧铜在从148gpa到219gpa的冲击压力下卸载到零压时，有卸载熔化发生。 |
| 10. | By testing , the total thermal of the microchannel heatsink for cooling high power semiconductor diode laser arrays is 0 . 645 / w , which is consistent with the result of theory counting
通过测试，所制得的无氧铜微通道热沉冷却半导体激光器的总热阻为0 . 645 ~ 0c w ，与理论分析基本吻合，满足散热要求。 |
