| 1. | Measurement challenges for on - wafer rf - soc test
晶圆上测试射频系统级芯片的挑战 |
| 2. | Scratch - a mark that is found on the wafer surface
擦伤-晶圆片表面的痕迹。 |
| 3. | Wlcsp wafer - level chip scale packaging technology
晶圆片级芯片规模封装技术 |
| 4. | Lay - the main direction of surface texture on a wafer
层-晶圆片表面结构的主要方向。 |
| 5. | Hot plate with silicon wafer lowered to heating position
加热板与矽晶圆降低至加热位置。 |
| 6. | Primary orientation flat - the longest flat found on the wafer
主定位边-晶圆片上最长的定位边。 |
| 7. | Waviness - widely spaced imperfections on the surface of a wafer
波纹-晶圆片表面经常出现的缺陷。 |
| 8. | Dual core processor meet critical requirement in multimedia applications
技术在晶圆级生产中的应用 |
| 9. | Even for china ' s bigger fabs , the going is rough
即便是中国的一些规模较大的晶圆厂，也同样举步为艰。 |
| 10. | Bonding interface - the area where the bonding of two wafers occurs
绑定面-两个晶圆触接的合结片区。 |
