| 1. | Impurities tend to segregate at grain boundaries .
杂质常常在晶粒间界偏析。 |
| 2. | Two area defects are twins and grain boundaries .
有两种面积缺陷，即孪生和晶粒间界。 |
| 3. | Evaluating intergranular corrosion resistance of heat treatable aluminum alloys by immersion in sodium chloride hydrogen peroxide solution
将铝合金浸入氯化钠和过氧化氢溶液中进行热处理时抗晶粒间腐蚀的评定 |
| 4. | Heat - treatment could enhance electric contact among crystal grains in particles and between the alloy and the substrate , thus the performance was improved obviously
热处理后由于改善了合金颗粒内部晶粒间,以及合金材料与基体间的电接触,循环性能明显提高。 |
| 5. | Simulating on polycrystalline cyclic deformation indicates that hardening first appears at grain boundary then spreads to grain inside . finally , hardening is not well - distributed in the specimen when deformation is limited
循环塑性模拟对于多晶材料的bauschinger效应和晶粒间硬化过程以及硬化在试样上的非均匀分布给出了相应的描述。 |
| 6. | Another is shear - model fracture which is thought that it is associated with dislocation motion ( shear + rotation ) of crystal at microlevel , fragmentation of solid at mesoscale level and large plastic strains at the macroscopic level
剪切型断裂在微观上与晶粒内或晶粒间的滑移和位错有关，细观上与集中变形带中的微剪切面集中有关，宏观上则与结构内的集中剪切带有关。 |
| 7. | The presence of small amount of liquid at grain boundaries tends to form thin viscous layer which surrounds the finer grains . intergranular fracture may occur at the grain boundaries between two fine grains not covered by viscous phases . the high ductility achieved at low strain rates is generally attributed to dislocation glide - creep accommodation mechanisms
原始晶界上产生少量液相，形成薄的固液共存粘性层并包围细化的晶粒，沿晶断裂主要发生在无粘性层的细晶粒间；而在较低应变速率下，三叉晶界位错攀援?蠕变协调机制松弛晶界滑移产生的应力集中，晶界上产生较多液相，有利于晶界滑移进行。 |
| 8. | The analysis of microstructure of samples showed that the grain of tio2 were very small under 700 , the distance of grain became small with temperature increasing , the rate and size of pore was decreasing . the relative density of sample at 900 was 97 % and the grain size of sintered body was about 200nm . when the temperature exceeded 1100 , the grain size of body grew up several times ( > 2 m )
Tio _ 2烧结体sem显微形貌分析表明：低温( 700 )时坯体内颗粒无明显长大，烧结体致密度不高( 80 )晶粒间距随温度升高而变小，气孔率也随之降低，气孔尺寸变小；当温度超过900时，晶粒间连接紧密，烧结体内出现大量絮状物质，致密度大幅度提高，达97以上，小气孔已聚集成大孔洞且分布均匀，晶粒长大不明显( 200nm左右) ；当温度超过1100时，烧结体致密度有所提高，但晶粒尺寸出现异常长大，长大了十几倍(达2 m以上) 。 |
| 9. | The flexural strength and fracture toughness of ti3sic2 material obtained by hot - pressing is 223mpa and 5 . 1 mpa m1 / 2 respectively ; the mechanisms of grain bending , grain delamination , crack deflection inside the layered grain , crack deflection and branch , pull out grain are main energy absorbing mechanisms
~ 1ti _ 3sic _ 2材料的弯曲强度和断裂韧性分别为223mpa和5 . 1mpa ? m ~ ( 1 / 2 ) 。主要能量吸收机制为：晶粒的弯曲、层间滑移，裂纹在层间扩展与偏转，裂纹在晶粒间沿晶界扩展、分叉和晶粒的拔出。 |
