| 1. | Mainly applying in second module power of
主要用于通讯电源中的二次模块电源。 |
| 2. | Moduler power circuit and its application
模块电源及其应用 |
| 3. | Dc - dc power module holds most of the market because of its large apply - occasion
Dc - dc模块电源由于应用场合广占据了模块电源的主要市场。 |
| 4. | Laser power supplies , module power supplies , fully - encapsulated power / voltage / current transformers
固体激光电源、半导体激光电源、模块电源、封装式电源变压器、电压电流互感器。 |
| 5. | Produces impedance and inductor chips , coil inductors , transformers , power cords and emi filter components . usa
-生产数据通信接口网络滤波器变压器通信模块电源dc dc及ac dc隔离电源等。 |
| 6. | The technique of paralleling current sharing of switching power is introduced ; the small signal model of the single dc / dc module and the multi - module is analyzed
文中介绍了电源并联运行的各种均流技术，对单模块dc dc电源和多模块电源并联运行进行了小信号分析。 |
| 7. | Due to the advantages such as high reliability , redundancy and good expansibility , power module becomes one of the important research field and applies widely
模块电源因具有可靠性高、冗余性强和易于扩展等优点成为电力电子技术一个重要的研究方向并得到了广泛应用。 |
| 8. | Standard 19 " 4u framework , can plug in 8 functional module and 1 power supply module module uses aluminium die - casting shell , provides iptimal heat dissipation and functional combination as following products
标准19 " 4u高，有10个插槽位，可插入8个功能模块， 1个电源模块电源模块有2个槽位，模 |
| 9. | The paper analyzes the key issues in the design of a high power modular power supply . a new three - dimensional package structures is introduced , and a prototype of 270vdc input , 28v / 36adc output is built in the lab
本文分析了大功率dc dc电源模块化的难点，采用一种新型的三维封装结构，完成了一台270vdc输入， 28v 36adc输出的dc dc模块电源，并对样机进行了测试。 |
| 10. | The assembly process and experimental results are included in this paper . in order to increase the power density of the module , a three - dimensional fc - ipem package structure is introduced . a half - bridge fc - ipem module is built in the lab with bga power devices and flip - chip technique
为实现更高的功率密度，本文把微电子行业中广泛应用的倒装芯片技术应用于模块电源研究中，完成了一个半桥fc - ipem ( flipchip - integratedpowerelectronicsmodule )模块。 |
