| 1. | Quality assessment of soldered joints of sma
表面组装组件的焊点质量评定 |
| 2. | The joints heat up as a result of the joule heating effect
焦耳热效应造成焊点温度提高。 |
| 3. | Non - destructive examination of fusion welds - visual examination
熔焊点的无损检验.目视检查 |
| 4. | Pcb nails , 110 " spot quick connect or screw endpoint
Pcb钉， 110 "焊点快速连接，或螺丝钉端点 |
| 5. | Effect of cpga gull wing lead size on reliability of soldered joints
翼形引线焊点可靠性的影响 |
| 6. | 110 " spot or pcb fast link endpoint
110 "焊点快速连接或pcb端点 |
| 7. | The reliability of lead - free solder joint
无铅焊点的可靠性问题 |
| 8. | Bga test technology amp; amp; quality control
焊点的质量控制 |
| 9. | Solder joint fatigue life predictions for csp package under power cycling
封装结构焊点的寿命预测分析 |
| 10. | Non destructive testing of welded joints - ultrasonic testing of welded joints
焊点无损检验.焊点超声检验 |
