| 1. | 4 . the noise of the substrate and the inductors of the pads are investigated in detail
4 .研究了衬底噪声和焊盘寄生电感对电路的影响。 |
| 2. | To achieve the required bump heights , the solder paste is over - printed onto the wafer bond pads
为了获得要求的凸起高度，锡膏在晶片焊盘过焊。 |
| 3. | Themal reliefs are sometimes also used on vias very near , or in , pads of smt components for the same reason
基于同样的原因，限热槽也用于贴片元件内或离元件很近的焊盘。 |
| 4. | When human has contact to touch pad , electric charge in the human body will be accumulated through the touch pad
当人体接触感应焊盘时，在人体里的电荷将被通过感应焊盘积累。 |
| 5. | During subsequent reflow the solder pulls back onto the wettable pad surface to form a solid solder bump structure
在下一个回流工序，锡膏浸润焊盘表面，形成一个固态锡膏凸起。 |
| 6. | Solder paste is applying for the connection between the mount components foot and pcb pads in the smt assembly
在表面贴装装配的回流焊接中，锡膏用于表面贴装元件的引脚或端子与焊盘之间的连接。 |
| 7. | Components required to be mounted off the board are provided with lead forms at the board surface or other mechanical support to prevent lifting of solder land
需要离开线路板安装的组件在线路板表面利用引脚形状或其它机械支撑来防止焊盘的翘起。 |
| 8. | The process and mechanism of ball bonding were studied in this paper , specifically , intermetallic compounds ( imc ) formation and reliability on copper wire and aluminum alloy pad bonding joint during thermal aging were analyzed in detail
本文在对铜丝球键合工艺和原理研究的基础上,着重分析了老化过程中铜丝球与铝合金焊盘键合的金属间化合物生长及可靠性。 |
| 9. | Quick diathermancy avoid damage to cmos chip and solder . precise design and good technics avoid damage due to attrition . vacuumize avoid alterative because of oxygenation during transportation . antistatic plastic core
传热吸收快,尽可能的避免对芯片和焊盘的损坏;精确的设计和制造工艺避免磨擦对焊盘可能造成的损坏;真空包装避免?品在运输途中氧化变质;防静电塑料芯;符合美国军队及国家宇航局各种标准 |
| 10. | The algorithm can be applied to connection routing in pcbs with various pad geometry and pad sizes , with different wire widths and variable distances between wires . the basic element in routing is the search line with a given destination . the main features of the router are the target orientation of the search lines , the routing efficiency is guaranteed by rationally designed data structures and by the ability of searching around obstacles , the small amount of working storage and the reasonably short routing time
该布线算法适用于焊盘外形尺寸不一，线宽及线间距离可变的印刷电路板布线，其基本要素是带有预定终点的探索线，特点是线探索具有目标针对性，设计合理的数据结构及灵活的绕障探索方式可大大提高搜索效率，所需存储量小，布线速度快。 |
