| 1. | Optimization thermal profile of solder in smt
微电子封装领域焊膏回流曲线的优化研究 |
| 2. | Reflow solder paste in 2 hours as soon as possible after printing
印刷后要在2小时内回流焊膏。 |
| 3. | Testing method for solderberg paste
软焊膏的测试方法 |
| 4. | Requirements for soldering paste
焊膏要求 |
| 5. | All solder powders that are used for our paste manufacturing are made under inert atmosphere and under tight quality control program
我们制造焊膏所使用的焊锡粉是在惰性气体和严格质量控制之下制成的。 |
| 6. | The operator should assure a shorter open time and make the paste be in good sealed status after we have taken sufficient solder paste once
开盖时间要尽量短，一次取出够用的焊膏后，应立即将内盖盖好。 |
| 7. | Do not touch solder paste bare - handed . remove with ethyl alcohol from body or clothes if contaminated by solder paste
小心使用焊膏，避免触及皮肤。若附于衣服或身体时，应尽快用含有酒精的溶剂把焊膏抹掉。 |
| 8. | Solvent may be easily vaporized when solder paste is contacted with air - conditioned current or wind and hence reducing its tackiness
不要将焊膏放近于风口的位置，因为这样会使焊膏中的溶剂蒸发，降低其粘性。 |
| 9. | Attachment materials for electronic assembly - part 1 - 2 : requirements for solder pastes for high - quality interconnections in electronics assembly
电子组件用连接材料.第1 - 2部分:电子组件中高质量互连用焊膏的要求 |
| 10. | Trough the experiment , we probed to the suited mount method ( mount with 183 soldering paste ) and bonding technique ( ball bonding with the gold silks of 18 m in diameter )
通过实验，探索出了合适的贴装方式( 183焊膏贴装)和管芯键合工艺(直径18 m的金丝球焊) 。 |
