Bga mechanical standardization of semiconductor devices - part 6 - 4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - measuring methods for package dimensions of ball grid array 半导体装置的机械标准化.第6 - 4部分:表面安装半导体装置封装外形图绘制的一般规则.球状网格阵列
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Mechanical standardization of semiconductor devices - part 6 - 4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; measuring methods for package dimensions of ball grid array 半导体器件的机械标准化.第6 - 4部分:绘制表面安装半导体器件封装外形图的一般规则.焊球网格陈列封装尺寸的测量方法图绘制的一般规则.球状网格阵列bga封装尺寸的测量方法