| 1. | Soft solder alloys - chemical compositions and forms
软钎焊合金.化学成份和形状 |
| 2. | Reference composition of fluxes used for soft soldering
软钎焊用助熔剂的标准成分 |
| 3. | Cast copper alloy solder joint pressure fittings
铸铜合金软钎焊连接压力管件 |
| 4. | Determining solderability of thick film conductors
厚膜导体的软钎焊性测定 |
| 5. | Soldering fluxes - classification , labelling and packaging
软钎焊用钎剂分类标记与包装 |
| 6. | Testing of solderability for soft soldering ; wetting tests
软钎焊可软钎性的检验.湿润试验 |
| 7. | Requirements for soldered electrical and electronic assemblies
软钎焊电气和电子组件的要求 |
| 8. | Standard test method for solderability of metallic - coated products
金属涂覆产品的软钎焊性试验方法 |
| 9. | Cast copper alloy solder joint drainage fittings - dwv ; errata
铸铜合金软钎焊连接排水管件. dwv .勘误 |
| 10. | Post solder solvent cleaning handbook
柱状软钎焊焊剂清洁手册 |
