| 1. | these most frequently used are the angstrom unit(a.u. or =cm)and the millimicron(mμ=cm).
通常是以埃（AU或cm）和毫微米（mcm）为单位。 |
| 2. | Cr / cu / cr film has been widely used in mcm - d
Cr cu cr是目前常用薄膜互连结构。 |
| 3. | Synthesis and catalytic performance of ti - mcm
41制备及其催化性能 |
| 4. | Modification and characterization of mcm - 41 mesoporous molecular sieve
41介孔分子筛的修饰与表征 |
| 5. | Progress in the research of mcm - 48 mesoporous molecular sieves membrane
48介孔分子筛膜的研究进展 |
| 6. | Mcm flip - chip - bonding technique used in fabrication of cmos - s eed smart pixel
灵巧象素中的应用研究 |
| 7. | Simulation of interconnection and package effect in high - speed mcm
布线网互连和封装效应的计算机仿真 |
| 8. | Assembly and characterization of semiconductor and mcm - 41 mesoporous material
41和半导体的组装与表征 |
| 9. | Synthesis and chemical modifies of mcm - 41 mesoporous molecular sieve
41型介孔分子筛的合成及其化学修饰 |
| 10. | Preparation and catalytic performance for polyethylene pyrolysis of al - mcm
41的制备及催化聚乙烯裂解反应 |
