| 1. | Review and prospect of solderable tin - based binary alloy plating
可焊性锡基二元合金镀层研究的现状与展望 |
| 2. | Phase - field simulation of non - isothermal solidification of binary alloy
二元合金非等温凝固过程的相场法模拟 |
| 3. | The calculations for enthalpies of formation for noble metal - stannum binary alloys
贵金属与锡二元合金的热力学性质的计算 |
| 4. | Cobalt - tungsten electrodeposit as copper barrier was presented in the paper
本文提出以电镀钴钨二元合金镀层作为防铜渗层。 |
| 5. | The theoretical prediction of amorphization for iron based binary by mechanical alloying
基二元合金机械合金化致非晶化的理论预测 |
| 6. | Numerical simulation of dendrite growth for binary alloy during non - isothermal solidification
二元合金非等温凝固枝晶生长的数值模拟 |
| 7. | Numerical simulation of solute segregation patterns for a binary alloy using phase - field approach
二元合金微观偏析的相场法数值模拟 |
| 8. | Numerical simulation of non - isothermal dendritic growth of binary alloy using phase - field method
二元合金非等温凝固枝晶生长的相场法模拟 |
| 9. | Numerical simulation on solute segregation during solidification in fiber reinforced aluminum - copper binary alloy composites
短纤维增强铝铜二元合金复合材料凝固偏析的数值模拟 |
| 10. | By comparing the activation area of binary alloy with that of ternary alloy catalyst , the introduction of multi - metal alloy catalyst is found to be able to increase the number of activation site
比较二元合金催化剂同三元合金催化剂的活性面积，发现采用多金属催化剂还能提高活性点的数目。 |
