| 1. | Analysis on pad effects in chemical mechanical polishing
化学机械抛光中抛光垫作用分析 |
| 2. | Chemical mechanical polishing for mutilevel interconnect in ulsi
多层互连中的化学机械抛光工艺 |
| 3. | Chemical mechanical polishing planarization , cmp
化学机械抛光 |
| 4. | Cmp dresser for semiconductor chemical and mechanical processing
半导体化学机械研磨垫钻石修整轮cmp dresser |
| 5. | Corrosion and passivation of copper in the cmp slurry of ch3nh2 - k3 fe
铁氰化钾化学机械抛光液中的腐蚀与钝化 |
| 6. | Chemmically - mechanically polish
化学机械抛光 |
| 7. | Chemi - groundowood process
化学机械方法制浆 |
| 8. | Chemical mechanical working
化学机械加工 |
| 9. | Chemi - mechanical pulp
化学机械浆 |
| 10. | Modeling of chemical mechanical polishing material removal based on molecular - scale mechanism
基于单分子层去除机理的芯片化学机械抛光材料去除模型 |
