| 1. | Specification for base materials for high speed high frequency applications
高速高频设备的基底材料规范 |
| 2. | Bond with different hard plastics
粘接在特殊基底材料上 |
| 3. | Specification for base materials for rigid and multilayer printed boards
硬质多层印制电路板基底材料的规范 |
| 4. | Metallic coatings on non - metallic basis materials - measurement of coating thickness - microresistivity method
非金属基底材料金属涂层.涂层厚度测量.微电阻率法 |
| 5. | Metallic coatings on nonmetallic basis materials - measurement of coating thickness - microresistivity method
非金属基底材料上金属覆层.覆层厚度的测量.微电阻率法 |
| 6. | The specimen in the experiments was manufactured with nafion - 117 ( dupont ) deposited two times with platinum
Ipmc试样是以nafion - 117薄膜为基底材料利用化学方法沉积pt离子制备的。 |
| 7. | Metallic coatings on nonmetallic basis materials - measurement of coating thickness - microresistivity method ; german version en 14571 : 2005
非金属基底材料上的金属覆层.测量覆层厚度.微电阻率 |
| 8. | Base materials for printed circuits - part 2 : specifications - specification no . 2 : phenolic cellulose paper copper - clad laminated sheet , economic quality ; amendment 5
印制电路用基底材料.第2部分:规范.第2号规范:经济质量的酚醛纤维素纸覆铜层压板.修改件5 |
| 9. | Base materials for printed circuits - part 2 : specifications - specification no . 1 : phenolic cellulose paper copper - clad laminated sheet , high electrical quality ; amendment 4
印制电路用基底材料.第2部分:规范.第1号规范:高电气质量的酚醛纤维素纸覆铜层压板.修改件4 |
| 10. | . 4 base materials for printed circuits - part 2 : specifications - specification no . 3 : epoxide cellulose paper copper - clad laminated sheet of defined flammability vertical burning test ; amendment 4
印制电路用基底材料.第2部分:规范.第3号规范:规定易燃性的环氧化合物纤维素纸铜覆层压板 |
