| 1. | Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.分规范 |
| 2. | Harmonized system of quality assessment for electronic components - capability detail specification : multi - layer printed boards
电子元器件用质量评估协调体系.性能详细规范:多层印刷电路板 |
| 3. | Harmonized system of quality assessment for electronic components - capability detail specification : flexible multilayer printed boards with through connections
电子元器件用质量评估协调体系.性能详细规范:整体连接挠性多层印刷电路板 |
| 4. | Harmonized system of quality assessment for electronic components - capability detail specification : flex - rigid multilayer printed boards with through connections
电子元器件用质量评估协调体系.性能详细规范:整体连接弯曲刚性多层印刷电路板 |
| 5. | Printed boards . part 4 : rigid multilayer printed boards with interlayer connections . sectional specification . section 1 : capability detail specification performance levels a , b and c
印刷电路板.第4部分:层间连接件的刚性多层印刷电路板.第1节:容量详细规范性能等级a b和c |
| 6. | New laminate products such as flame - retardant paper laminates and glass epoxy laminates for multi - layered pcbs were introduced during the year to capture new market demands
为配合市场需要，集团已于年内推出绝缘性能较佳的环保防火纸覆铜面板fr2及供多层印刷电路板用的薄玻璃纤维覆铜面板。 |
| 7. | Base materials for printed circuits - part 2 - 12 : specifications : thin epoxyde wowen glass fabric copper - clad laminated sheet of defined flammability , for use in the fabrication of multilayer printed boards
印刷电路用基材.第2 - 12部分:规范.多层印刷电路板制作用规定易燃性的环氧树脂机织玻璃纤维织物包铜层压板 |
| 8. | Base materials for printed circuits . part 2 : specifications . specification no 11 : thin epoxide woven glass fabric copper - clad laminated sheet , general purpose grade , for use in the fabrication of multilayer printed boards
印刷电路用基材.第2部分:规范. 11号规范:多层印刷电路板制作用一般用途级环氧化合物机织玻璃纤维织物包铜层压薄板 |
| 9. | Base materials for printed circuits . part 2 : specifications . specification number 17 : thin polyimide woven glass fabric copper - clad laminated sheet of defined flammability for use in the fabrication of multilayer printed board
印刷电路用基材.第2部分:规范. 17号规范:多层印刷电路板制作用规定易燃性的聚酰亚胺机织玻璃纤维织物包铜层压板 |
| 10. | Base materials for printed circuits . part 2 : specifications . specification no 12 : thin epoxide woven glass fabric copper - clad laminated sheet of defined flammability , for use in the fabrication of multilayer printed boards
印刷电路用基材.第2部分:规范. 12号规范:多层印刷电路板制作用规定易燃性的环氧化合物机织玻璃纤维织物包铜层压薄板 |
