| 1. | Application guide for multilayer ceramic capacitors - electrical
电气用多层陶瓷电容器的应用指南 |
| 2. | The reasons and resolve of plating layer blister on multilayer ceramic package
多层陶瓷外壳电镀层起泡的成因和解决措施探讨 |
| 3. | Detail specification of multilayer ceramic dual in - line package for semiconductor integrated circuits
半导体集成电路多层陶瓷双列直插外壳详细规范 |
| 4. | Blank detail specification - fixed multilayer ceramic surface mounting capacitors - assessment level dz
空白详细规范.多层陶瓷表面镶嵌固定电容器.评定等级dz |
| 5. | Ceramic capacitors at high frequencies , method of test for effective series resistance and capacitance for multilayer
高频多层陶瓷电容器有效串联电阻和电容的试验方法 |
| 6. | Components for electric equipment . type 1 and type 2 fixed multilayer ceramic chip capacitors . general requirements
电子设备元件. i型和ii型多层陶瓷芯片固定电容器.一般要求 |
| 7. | Blank detail specification : fixed multilayer ceramic surface mounting capacitors - assessment level dz ; german version en 132102 : 1996
空白详细规范:平面式安装多层陶瓷固定电容器.质量评 |
| 8. | Harmonized system of quality assessment for electronic components ; sectional specification : fixed multilayer ceramic chip capacitors
电子元件质量评估协调体系.分规范.第19部分:多层陶瓷 |
| 9. | Fixed capacitors for use in electronic equipment part 10 : sectional specification : fixed multilayer ceramic chip capacitors
电子设备用固定电容器.第10部分:分规范:多层陶瓷片状固定电容器 |
| 10. | Fixed capacitors for use in electronic equipment ; part 10 : sectional specification : fixed multilayer ceramic chips capacitors ; amendment 1
电子设备用固定电容器.第10部分:分规范:固定多层陶瓷片电容器.第1次修改 |
