| 1. | Analysis of transfer characteristic for high frequency signals in mcm substrate
多芯片基板高频信号传输特性分析 |
| 2. | Multi - chip module
多芯片模块 |
| 3. | The concepts of " micromachining " and multi - chip - module ( mcm ) integrated from dc to rf components will be explained also
文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。 |
| 4. | In this paper the applications of diamond material to mcm to improve thermal characteristics and thermal stress problem are studied
本文研究了金刚石材料在多芯片组件中热特性改善和热应力问题。 |
| 5. | At present , dsl transceiver design use the method of multi - chip integration , which makes the cost high and makes dsl hard to popularize in large scale
目前dsl收发器的设计采用多芯片集成的方法，多芯片集成的方法成本偏高，使得dsl技术难于大规模推广。 |
| 6. | Results in the paper will supply references to thermal designs of multi - chip module packaging based on diamond material
本文对金刚石材料在多芯片组件热性能改善和热应力研究,对金刚石在多芯片组件封装热设计应用具有一定的参考价值和提供一定的理论依据。 |
| 7. | Firstly , background of the project was introduced , including characters of multi - chip module , electronic design automation and our destination
首先介绍了该课题的背景，包括多芯片组件的发展与特点，现代电子设计自动化的相关进展，以及我们的工作目标。 |
| 8. | In this paper outlining the characteristics of diamond substrate and problems to be faced with , and measures to be taken , introducing knowledge of multi - chips modules packaging
本文首先综述了热沉用金刚石基板的特点和面临的问题及相应的措施;并介绍了多芯片组件封装技术相关知识。 |
| 9. | Since the soc design excels multi - chip in speed , power consuming and cost , it is of extreme importance to develop soc design in future ic industry
由于单片系统级芯片设计在速度、功耗、成本上与多芯片系统相比占有较大的优势，因此发展soc设计在未来的集成电路设计业中将有举足轻重的地位。 |
| 10. | They are usually packaged together in multi - chip modules of 20 or 30 chips or more : fully one half of them are there as backups , ready to take over if an active chip fails
大型机芯片通常会将20或30甚至更多个芯片封装在一个多芯片模型（ mcm ）中：其中一半用作备用芯片，以便在活动芯片失效时立即接管这些芯片的工作。 |
