| 1. | Mechanical dimensions will continue to be driven by equipment and processing needs .
机械尺寸将继续受设备与工艺要求的控制。 |
| 2. | Technic demands on whisper operation and well completion
侧钻井施工作业及完井工艺要求 |
| 3. | Workmanship requirements for soldered electronic assemblies - general
钎焊电子组件的工艺要求.总则 |
| 4. | Technological requirements for ship upgrading or launching relying on air - bags
船舶用气囊上排下水工艺要求 |
| 5. | Workmanship requirements for soldered electronic assemblies - terminal assemblies
钎焊电子组件的工艺要求.终端组件 |
| 6. | Workmanship requirements for soldered electronic assemblies - part 1 : general
钎焊电子组件的工艺要求.第1部分:总则 |
| 7. | Workmanship requirements for soldered electronic assemblies - part 1 : general
钎焊电子组件的工艺要求.第1部分:总则 |
| 8. | Building and technology requirements of outdoor equipment of satellite earth station
卫星地球站室外设备土建及工艺要求 |
| 9. | Temperature is multistratum controlled and adjustable for different requirements
温度多段控制，根据工艺要求作不同调整。 |
| 10. | Install lighting tower electrical system according to design and process procedure
根据电路图和工艺要求装配灯塔电路系统。 |
