| 1. | An image of the patterns on the mask is projected onto the resist-coated wafer, which is many centimeters away .
掩膜板上图形的像被投影到许多厘米以外的涂有抗蚀剂的片子上。 |
| 2. | The final ic is made by sequentially transferring the features from each mask, level by level, to the surface of the silicon wafer .
按照顺序从每一块掩膜版上将图形一层一层地转移到硅片的表面，就制得了成品集成电路。 |
| 3. | In early ic fabrication practice, etch bias was usually dealt with by introducing an appropriate amount of compensation in the masking layer .
在早期的集成电路制作实践中，刻蚀偏差通常是通过在掩膜层上引入一个适量的修正来处理的。 |
| 4. | "pattern transfer" refers to the transfer of a pattern, defined by a masking layer, into a film or substrate by chemical or physical methods that produce surface relief .
“图形转移”是指把掩膜层所确定的图形通过能产生表面转移的化学或物理方法转移到薄膜上或衬底上去。 |
| 5. | Lithography - the process used to transfer patterns onto wafers
光刻-从掩膜到圆片转移的过程。 |
| 6. | Test method for distortion of optical lenses used in photomask fabrication
光掩膜制作用光学透镜畸变的试验方法 |
| 7. | Vacuum deposition mask
真空沉积掩膜 |
| 8. | Investigation of ion depth profile in silicon implanted by focused ion beam
聚焦离子束无掩膜注入单晶硅离子浓度浓度分布的研究 |
| 9. | A novel apparatus to measure the step height of the mask by means of non - contact method
一种新型的非接触式掩膜板台阶高度测量仪 |
| 10. | Bipolar mask bus
双极掩膜总线 |
