| 1. | Procedure for system - level temperature cycle endurance test
系统级温度循环耐久性试验程序 |
| 2. | Semiconductor devices - mechanical and climatic test methods - temperature cycling
半导体器件.机械和气候试验方法.温度循环 |
| 3. | Temperature cycling test
温度循环试验 |
| 4. | Test method for axial load temperature cycling of drop cable connector interface
分接电缆连接器接口的轴向负荷温度循环试验方法 |
| 5. | Standard practice for determining the effects of temperature cycling on fenestration products
测定穿孔产品温度循环效果的标准实施规程 |
| 6. | Semiconductor devices - mechanical and climatic test methods - part 25 : temperature cycling
半导体器件.机械和气候试验方法.第25部分:温度循环 |
| 7. | Semiconductor devices - mechanical and climatic test methods - part 25 : temperature cycling
半导体器件.机械和气候试验方法.第25部分:温度循环 |
| 8. | Communication cables - specifications for test methods - environmental test methods - temperature cycling
通信电缆.试验方法规范.环境试验方法.温度循环 |
| 9. | Communiaction cables - specifications for test methods - part 4 - 6 : environmental test methods - temperature cycling
通信电缆.试验方法规范.第4 - 6部分:环境试验方法.温度循环 |
| 10. | Procedure to measure temperature cycling effects on optical fiber , optical cable , and other passive fiber optic components
温度循环对光纤光缆和其他无源光纤元件影响的测量程序 |
