| 1. | Amounts of moisture in soil vary greatly .
土壤中湿度变化很大。 |
| 2. | Standard test method for dimensional stability of fabrics to changes in humidity and temperature
温度和湿度变化时织物尺寸稳定性的标准试验方法 |
| 3. | Door leaves - determination of the behaviour under humidity variations in successive uniform climates
门扇.在连续不变气候条件下门扇抗湿度变化性测定 |
| 4. | Door leaves - determination of the behaviour under humidity variations in successive uniform climates ; german version en 1294 : 2000
门扉.连续标准气候下湿度变化时的状态测定 |
| 5. | Resilient floor coverings . determination of dimensional stability of linoleum tiles caused by changes in atmospheric humidity
弹性地板覆盖物.由于空气湿度变化引起油毡尺寸变化的测定 |
| 6. | Resilient floor coverings - determination of dimensional stability of linoleum tiles caused by changes in atmospheric humidity
弹性地板覆盖物.由大气湿度变化引起的油地砖的尺寸稳定性变化的测定 |
| 7. | To explore the importance of soil moisture on land - atmosphere heat and water exchange , the impact of soil moisture on reflectivity and associated aspects of land surface modeling are also examined
本文中还研究了土壤湿度和土壤反射率之间的关系，并讨论了在陆面过程模式中考虑反射率随土壤湿度变化对模式模拟结果的影响。 |
| 8. | Bonic 8580 medium sealant is a multipurpose , one - part product that adheres without priming to a variety of materials and cures to a durable , flexible silicone rubber upon exposure to water vapor in the air
Bonic 8580中性密封剂是一种多用途，单一组份,常温固化，能够持久灵活粘接之矽酮胶，其乾燥情况视空气湿度变化而不同。 |
| 9. | The bridges will gradually wear down under the circumstances of the natural environment , such as the atmosphere erosion , the changes of the temperature and the humidity , and applied environment , such as the loading , the fatigue of the material and the structure
桥梁长期在自然环境(大气腐蚀、温度、湿度变化)和使用环境(荷载作用与频率的增加、材料与结构的疲劳)的作用下,会出现逐渐退化的趋势。 |
| 10. | As the experiment results show , multiple reasons led to the offset of oscillating frequency , including diode ’ s nonlinear characteristic , fluctuation of electrical source voltage , traction of load impedance , change of environmental temperature and humidity and the design of circuit
实验结果表明多种因素引起了振荡频率的偏移,包括二极管的非线性、电源电压的波动、负载的牵引、环境温度湿度变化以及电路板设计方面的因素等。 |
