| 1. | A defect model is suggested to account for the pl of sintered psc
发光峰的强度随着烧结时间的增加略有下降，多孔碳化硅的发光来自于缺陷态。 |
| 2. | Accordingly , the degree of degradation is observed to enhance if the period of the sintering process is too long
由此发现过度加长烧结时间有加速劣化的趋势。 |
| 3. | The results show that the grain size of cosb3 grows with increasing sintering temperature or sintering time
结果表明：随着烧结温度的增加和烧结时间的延长，烧结体的晶粒有明显长大。 |
| 4. | Sintering time ranges from 3 to 10 hours , and sintering temperature ranges from 160ctc to 1900 ? , under an ar . protection of 1 . 0 atm
在1 . 0atm的ar气保护下进行烧结，选用的烧结时间从3小时到10小时，烧结温度由1600到1900 。 |
| 5. | The highest sintering temperature was 900 c , and the sintering lasted 70 seconds . the conventional sintered magnets were sintered at 1000 c for 1h
常规烧结的温度为1000 ，烧结时间为1h ，并分别在800和600各进行1h的回火。 |
| 6. | When sintering temperature and sintering time are 625 c and 7min respectively , the densenfied bulk thermoelectric materials with mean grains size of 100nm were prepared
当烧结温度为625 ，烧结时间7min时，得到了最小平均晶粒尺寸为100nm的cosb _ 3密实块体材料。 |
| 7. | Any products were prepared without impurities . the sps method was used to sintering the zrnisn - based compounds . the influence of different reaction temperature and holding time to density was discussed in detail
采用放电等离子法( sps )烧结制备zrnisn基化合物，并探讨了不同的烧结温度和烧结时间对材料致密度的影响。 |
| 8. | The mechanical and physical properties of the obtained w - cu composites were also tested . it was found that the property of the starting w - cu powder has a great influence on the sintering densification of the powder compacts
对上述粉体的性能进行了表征，并研究了烧结温度和烧结时间对烧结体的物理、力学性能及组织结构的影响。 |
| 9. | It showed that better crystal films could formed when sintered between 350 ~ 550 for 3 hours . with the increasing of temperature and the extending of time , the diffraction apices became stronger and the crystal became bigger
薄膜电极的烧结工艺研究结果表明,当烧结温度在350 ~ 550烧结时间为3h时得到结晶良好的limn2o4薄膜,随着温度的升高,衍射峰越来越明显,晶粒越来越大。 |
| 10. | As shown by the measurements , the electrical resistivity of sintered psc has a tendency of first decreasing and then increasing as the sintering temperature and / or sintering time increase . also it decreases with the increased pressure on the pressed powder compact
对样品的电阻率进行了测量，总体呈现出随烧结时间和烧结温度的增加而先降低后增加的趋势，并随压坯的成型压力的增加而降低。 |
