| 1. | Method for determination of stresses in glass - to - glass sealings
玻璃对玻璃密封应力测定方法 |
| 2. | . . . i had this entire room glassed in . .
我把这整个房间用玻璃密封 |
| 3. | I had this entire room glassed in
我把这整个房间用玻璃密封 |
| 4. | Sealing of glazings with sealants - part 2 : sealants , designation , requirements , testing
门窗玻璃密封剂密封.第2部分:密封剂命名要求和试验 |
| 5. | Standard test method for compatibility of insulating glass edge sealants with liquid - applied glazing materials
绝缘玻璃密封条与液体外加玻璃材料的混用性的标准试验方法 |
| 6. | The dynamic characteristics of the machine pressing glass seal in eq6472 light bus are analysed
摘要对东风轻型客车eq6472前门玻璃密封条气动压装机系统进行了动态特性分析。 |
| 7. | Sequences of serious quality problems caused by the use of the sealant filled by mineral oil and the harmfullness in using were analysed
深入分析了掺油中空玻璃密封胶所带来的一系列严重的质量问题及其在使用过程中的危害性。 |
| 8. | Mechanical standardization of semiconductor devices - general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.表面安装半导体器件封装外形图绘制一般规则.玻璃密封陶瓷方型扁平封装设计指南 |
| 9. | G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.第6 - 8部分:半导体器件包装用表面安装略图制备的一般规则.玻璃密封的陶瓷四方块的设计指南 |
| 10. | G - qfp mechanical standardization of semiconductor devices - part 6 - 8 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages ; design guide for glass sealed ceramic quad flatpack
半导体器件的机械标准化.第6 - 8部分:表面安装半导体器件封装外形图绘制的一般规则.玻璃密封的陶瓷四边形扁平组件的设计指南 |
