| 1. | Current status of research on electronic packaging materials
电子封装材料的研究现状 |
| 2. | Microstructures and properties of si - al alloy for
喷射沉积硅铝电子封装材料的组织与性能 |
| 3. | The challenge of changeover to lead - free in electronic packaging
电子封装面临无铅化的挑战 |
| 4. | Application and development of cad in electronic packaging
技术在电子封装中的应用及其发展 |
| 5. | New progress of electronic packaging technology
电子封装技术的新进展 |
| 6. | A review of metal - martix composites for electronic packaging
电子封装用金属基复合材料的研究现状 |
| 7. | Present status and progress in study of electronic packaging materials
电子封装材料的研究现状及进展 |
| 8. | Review of metal - matrix composite materials for electronic packaging
金属基电子封装复合材料的研究进展 |
| 9. | Recent achievements in research for electronic packaging substrate materials
电子封装基片材料研究进展 |
| 10. | Flip chip bonding technology used in modern micro - photoelectron package
现代微光电子封装中的倒装焊技术 |
