| 1. | Figure 7 shows the sequence for tape bonding the chip and assembling the package .
图7所示为带状引线连接芯片和管壳装配的工艺程序。 |
| 2. | To avoid the exposure of the die and its wire or tape bonds to viscous molding material, the premolded package concept was developed .
为了避免管芯裸露出以及引线或带状引线与粘滞的模压材料相粘合，才提出前模压管壳的概念。 |
| 3. | Ceramic parts of case for power semiconductor devices
电力半导体器件用管壳瓷件 |
| 4. | Research on a new pipe shell - type baffle - rod heat exchanger
新型折流杆管壳式换热器研究 |
| 5. | Shell and tube graphite falling - film absorber
管壳式石墨降膜吸收器 |
| 6. | Circular corrugated heat exchange tubes for tube shell exchangers
管壳式换热器用横槽换热管 |
| 7. | The ceramic housing used in vacuum interrupter
真空开关管用陶瓷管壳 |
| 8. | Dental cartridges for local anaesthetics
局部麻醉用牙管壳 |
| 9. | Case for power semiconductor device
电力半导体器件用管壳 |
