Base materials for printed circuits . part 3 : special materials used in connection with printed circuits . specification no . 1 : prepreg for use as bonding sheet material in the fabrication of multilayer printed boards 印制电路用基材.第3部分:印制电路用的特殊材料.第1号规范:制造多层印制板中用作粘结片材料的预浸材料
3.
Metal - clad base materials for printed wiring boards - special materials used in connection with printed circuits - specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed board 印制电路板用覆箔板.第103部分:印制电路连接专用材料.第1节:多层印制电路板制造用粘结片材的半固化片规范
